Capabilities

Detailed limits below. Final specs are confirmed from your Gerber and fab notes.

Max layers: Up to 48 layers
Max board size: 23.62″ × 39.37″ (599.95 × 1000 mm)
Min trace / space: 2 mil (0.05 mm)
Min laser drill size: 3 mil (0.0762 mm)
Min dielectric thickness: 2 mil (0.05 mm)
Copper weight: Inner up to 5 oz / outer up to 11 oz
Controlled impedance: ±7%
Hole size tolerance: NPTH ±2 mil (±0.05 mm) / PTH ±3 mil (±0.075 mm)
Blind / buried vias: Supported
Materials: FR-4, FR-4 High-Tg, Aluminum, Rogers, Arlon, and more
Surface finish: HASL, LF HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, Flash Gold
Certifications: ISO 9001 · ISO/TS16949 · ISO 14001 · UL · GP · RoHS · IPC Class II & III
Monthly capacity: 120,000 m²

Equipment